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The process induced defects consist of chips/indents (surface and edge) and cracks (not to mention the surface itself)
This method is to be used by CCFL suppliers and users to evaluate quality of products as well as items under development
It states requirements for both the user and manufacturer and establishes leak rate limits for acceptance testing and qualification testing
A BOLTS-M compliant load port unit (that would conform to SEMI E63)
S02300 - SEMI S23 - 半導體製造設備之能源、電力、原料節約基準 Revision:SEMI S23-0705 - Superseded The process induced defects consist200552020056www. semi. org2005720053200507 SME LCA Referenced SEMI Standards SEMI S2 Environment, Health and Safety Guideline for Semiconductor Manufacturing Equipment SEMI E6 Guide for Semiconductor Equipment Installation Documentation
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